Principal / Senior Engineer, New Product Introduction - IC Packaging, Technical Operations Management

Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.Ensure Manufacturability and Product Ramp-Up.Prepare and present reports on NPI project status, risks and milestones.Drive Failure Analysis (FA) to identify Root Causes for issues.Perform Risk Assessments such as Failure Mode and Effects Analysis.Develop, align and monitor Qualification Process.Interface to Quality Department for Quality Confirmation.Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.Establish Part Traceability Concepts.Conduct risk assessments and implement mitigation strategies